GENERAL | NX-P500 | |
---|---|---|
Frequency Range | 450 - 470 MHz | |
Number of Channels | 16CH | |
Channel Spacing | Analog | 12.5/25* kHz |
Digital - NXDN | 6.25/12.5 kHz | |
Power Supply | 3.8 V DC ± 10 % | |
Battery Life | 5-5-90 | |
KNB-81L Save On | Approx. 15.5 hours | |
KNB-81L Save Off | Approx. 14 hours | |
Operating Temperature | -14 °F to +140 °F (-10 °C to +60 °C) | |
Frequency Stability | ±2.5 ppm | |
Dimensions (W x H x D) Projections Not Included | 1.97 x 3.70 x 1.07 in (50 x 94 x 27 mm) | |
Weight Radio Full Keypad Model | 5.64 oz (160 g) | |
RECEIVER | ||
Sensitivity | NXDN® 6.25 kHz Digital (3% BER) | 0.25 μV |
NXDN®12.5 kHz Digital (3% BER) | 0.25 μV | |
Analog 12.5 kHz (12dB SINAD) | 0.28 μV | |
Analog 25 kHz | 0.25 μV | |
Selectivity | AnalogA 12.5 kHz | 50 dB |
AnalogA 25 kHz | 60 dB | |
Intermodulation | 50 dB | |
Spurious Rejection | 55 dB | |
Audio Distortion | Less than 10% | |
Audio Output Power | 750 mW (Internal) / 100mW (External) | |
TRANSMITTER | ||
RF Power Output (High / Mid / Low) | 2W / 1W | |
Spurious Response | 50 dB | |
FM Hum & Noise | AnalogA 12.5 kHz | 40 dB |
AnalogA 25kHz | 45 dB | |
Emission Designator | 4K00F1E, 4K00F1D, 4K00F7W, 4K00F2D, 8K30F1E, 8K30F1D, 8K30F7W (Digital) 16K0F3E, 11K0F3E (Analog) |
|
Audio Distortion | Less than 5 % |
* 25 kHz are not included in the models sold in the USA or US territories.
Analog measurements made per TIA603. Specifications are measured according to applicable standards.
Specifications shown are typical and subject to change without notice, due to advancements in technology.
MIL Standard | MIL 810C Methods/ Procedures |
MIL 810D Methods/ Procedures |
MIL 810E Methods/ Procedures |
MIL 810F Methods/ Procedures |
MIL 810G Methods/ Procedures |
---|---|---|---|---|---|
Low Pressure | 500.1/Procedure I | 500.2/Procedure I, II | 500.3/Procedure I, II | 500.4/Procedure I, II | 500.5/Procedure I, II |
High Temperature | 501.1/Procedure I, II | 501.2/Procedure I, II | 501.3/Procedure I, II | 501.4/Procedure I, II | 501.5/Procedure I, II |
Low Temperature | 502.1/Procedure I | 502.2/Procedure I, II | 502.3/Procedure I, II | 502.4/Procedure I, II | 502.5/Procedure I, II |
Temperature Shock | 503.1/Procedure I | 503.2/Procedure I | 503.3/Procedure I | 503.4/Procedure I, II | 503.5/Procedure I |
Solar Radiation | 505.1/Procedure I | 505.2/Procedure I | 505.3/Procedure I | 505.4/Procedure I | 505.5/Procedure I |
Rain | 506.1/Procedure I, II | 506.2/Procedure I, II | 506.3/Procedure I, II | 506.4/Procedure II, III | 506.5/Procedure II, III |
Humidity | 507.1/Procedure I, II | 507.2/Procedure II, III | 507.3/Procedure II, III | 507.4 | 507.5/Procedure II |
Salt Fog | 509.1/Procedure I | 509.2/Procedure I | 509.3/Procedure I | 509.4 | 509.5 |
Dust | 510.1/Procedure I | 510.2/Procedure I | 510.3/Procedure I | 510.4/Procedure II, RED | 510.5/Procedure I |
Vibration | 514.2/Procedure VIII, X | 514.3/Procedure I | 514.4/Procedure I | 514.5/Procedure I | 514.6/Procedure I |
Shock | 516.2/Procedure I, II, V | 516.3/Procedure I, IV | 516.4/Procedure I, IV | 516.5/Procedure I, IV | 516.6/Procedure I, IV |
Dust & Water Protection | IP54/55/67 |
---|